Thermal pad-導熱墊片

Thermal pad-導熱墊片

PRODUCTS

TYPE

DENSITY
(g/cm3)

Thickness
(mm)

COLOR

Thermal conductivity
(W/M.K)

Dielectric Strength
(VPM)

Application

TP-6001

Silicone

2.0

0.25-2.0

Grey

1.1

225

CPU/High power

TP-6002

Silicone

2.0

0.25-2.0

Grey

0.9

225

CPU/High power

TP-6003

Silicone

3.3

0.5-1.0

Grey

3.5

100

CPU/High power

TP-6004

Silicone

2.5

0.15-1.0

Grey

1.3

707

CPU/High power

TP-6005

Silicone

1.9

2.2-4.6

Grey

0.7

225

CPU/High power